Use of thermal paste
Most of the mobo manuals indicate applying thermal paste between CPU and Heat sink.
Is this really required during a fresh installation?
I am aware of heat sink of box pack AMD CPU having some thermal material already present on it’s bottom surface which comes in contact with processor die.
Is it true for other CPUs like AMD Sempron, P4 etc?
Thanks..
Is this really required during a fresh installation?
I am aware of heat sink of box pack AMD CPU having some thermal material already present on it’s bottom surface which comes in contact with processor die.
Is it true for other CPUs like AMD Sempron, P4 etc?
Thanks..
